Thermo-mechanical stresses have been considered as major concern in electronic packaging assembly structural failure which include interfacial delamination and die cracking. The studies and verifiacation on the interfacial shear stress will be important to understand and predict the maximum allowable deformation period before failure. The thermal mismatch shear stress for Multi-layered assembly can be analyzed by using the mathematical models developed by most of the researcher and later improved and modified. In this research, Finite Element Method (FEM) simulation was performed to a packaging by using ANSYS and results were compared to determine the validity of the results.