Thermomechanical stresses have been considered as one of the main concern in electronic packaging assembly structural failure, which include delamination and crack. The interfacial stresses would have caused by the thermal mismatch induced by the coefficient of thermal expansion (CTE) difference between materials, typically during the high temperature change in the bonding process. The studies on the interfacial shear stress would be important to understand the maximum allowable deformation prior to the failure.